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Triple*Ease™ Card
Frames / Card Cages / Sub-Racks |
Triple E Corporation manufactures
and assembles a full line of rugged card frames and card cages
supporting a variety of bus structures including VME, VME64X,
VXI and cPCI. All frames and cages are solid metal construction,
including the card guides, which eliminates problems of misalignment
and flexing, and is extremely efficient for conducting and
removing heat.
Triple E’s card frames with extruded card guides are
available in standard depths from 160mm to 400mm with optional
transition modules from 60mm to 160mm. Side plates are assembled
to the guide deck rails with stainless steel screws to help
insure rigidity of the assembly. For IEEE1101.10 compliant
and High Force models, an optional stainless steel injector/ejector
plate is available for demanding applications requiring greater
insertion/extraction force capability.
Available standard finishes include Iridite and non-conductive
powder coat which is highly resistant to chipping and scratching.
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VME64x
and CompactPCI (IEEE1101.10) Card Frames / Card Cages
901
Series Card Frames
This new series of card frames is based on 901 Series aluminum
guide clusters, which are a direct replacement for conventional
plastic guides. These patented card frames/card cages are strong,
durable, and rugged assemblies that meet IEEE1101.10 and IEEE.1101.11
specifications. Fully compliant with all VME64X and cPCI standards,
the 901series card frames support all keying, ESD, alignment
pin and EMI features.
Triple*Ease™ 901 series card frames are available in a broad
range of configurations. The front extrusion injector / ejector
lip comes standard in aluminum or can be ordered with an optional
stainless steel plate for extra strength and virtually unlimited
insertion / extraction cycles. The stainless steel injector
/ ejector lip is recommended for 9U tall PCB’s and cards
deeper than 220mm.
Key Features
- Monolithic aluminum extruded card guides any length
from 60mm to 400mm
- Screw attachment to front and rear rails
- Rails have two tapped holes each end
- Powder coat finish over clear chromate
- Optional stainless steel inject/eject plate
Benefits
- Provides an un-interrupted board guide
- Greater shock and vibration resistance
- Eliminates rotation of rails during board insertion
- Highly durable and environmentally safe
- Design integrity
- Increased rigidity and longer life
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MaxAir.10™ (IEEE1101.10
and IEEE1101.11) Card Frames
MaxAir.10™ card frames are based on the unitized construction
pioneered by Triple E. They are ideal for rugged commercial,
industrial and military applications. The robust design provides
up to 30% more area between card guides for improved cooling
performance. In addition to the enhanced CONVECTION cooling,
the all aluminum construction also provides the circuit boards
a heat CONDUCTION path not possible with plastic card guides.
No plastic means no flexing, bending or breaking of card guides
with better shock and vibration performance. NO ASSEMBLY REQUIRED – the
fully assembled card frames are available in all standard VME64X
and cPCI configurations from 3 to 21 slots with circuit card
depths from 160mm to 400mm. Optional IEEE1101.11 compliant
transition module available for 80mm cards(other sizes supplied
on special order).The all extruded aluminum construction permits
endless possibilities for custom non-standard variations. See
ordering information for standard sizes. Contact
factory for
custom requirements.
Key Features
- Monolithic aluminum extruded card guides
- Press-fit guide to rail assembly
- Powder coat finish over clear chromate
- Interchangeable injector / ejector plates (aluminum and
stainless steel)
Benefits
- Provides an un-interrupted board guide
- Will meet MIL-STD-901 and MIL-STD-167
- Eliminates rotation of rails during board insertion
- Highly durable and environmentally safe
- Offers greater application flexibility
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VME+
(IEEE1101.1+) MaxAir High Force Card Frames
Triple E now offers High Force Card Frames for applications
requiring the inject/eject capabilities of IEEE1101.10, but
not all the keying, ESD and EMI features. Think of it as STANDARD
VME (IEEE1101.1) PLUS the addition of inject/eject capability.
Don’t pay for features you don’t need or use. The
same mechanical and thermal capabilities of MaxAir.10™ Card
Frames, but without all the other enhancements of IEEE1101.10.
High Force Card Frames are available with aluminum or stainless
steel inject/eject plates. Stainless steel is recommended for
all 9U applications and 6U applications requiring frequent
PCB insertions and extractions. Compatible with VME, VME64x
and cPCI circuit boards and front panels.
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VME
(IEEE1101.1) Card Frames
These card frames utilize a patented design which provides
a durable, ruggedized assembly featuring an extruded panel
of card guides. These card guides are on 0.80” pitch
and can support PCBs up to 400mm in depth. The assembly is
very resistant to shock and vibration making it an ideal choice
for harsh commercial, industrial and military applications.
Unlike plastic card guide systems, these all-aluminum card
frames eliminate the problem of guide flexing and breakage.
Maxair™ VME
Card Frames
MaxAir™ VME Card Frames are designed to achieve very efficient
cooling and provide up to 20% lower forced air back pressure
as compared to competitive models with plastic card guides.
Rugged
VME Card Frames
Rugged VME Card Frames are recommended for applications that
may be exposed to extreme shock and vibration environments.
The extra wide front and rear rail extrusions are mounted to
the side plates with two stainless steel mounting screws at
each end and provide a solid structure to guide and secure
the cards. The extra wide front and rear extrusions also resist
bowing when inserting or extracting cards in large 400mm card
frames.
Key Features
- Monolithic extruded aluminum card guides
- Press-fit structural assembly
- Powder coat finish
Benefits
- Provides an un-interrupted board guide
- Will meet MIL-STD-901 and MIL-STD-167
- Eliminates rotation of rails during board insertion
- Highly durable and environmentally safe
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